| 项目 |
ITEM |
技术指标TECHNICAL
PARAMETER |
| 层数 |
LAYERS |
1-8（层）LAYERS |
最大加工面积
单面/双面板
多层板 |
Max.Board
SizeSingle Sided/Double Sided PCBMultilayer PCB |
450mm×600mm |
| 板厚 |
Board
Thickness |
0.25-3.2mm |
| 最小线宽 |
Min.
Line Width |
0.10mm |
| 最小间距 |
Min
Space |
0.10mm |
| 最小孔径
|
Min
Hole Size |
0.25mm |
| 孔壁铜厚 |
PTH
Wall Thickness |
＞0.025mm |
| 金属化孔径公差 |
PTH
Hole Dia Tolerance |
±0.076mm |
| 非金属化孔径公差 |
Non
PTH Hole Dia Tolerance |
±0.05mm |
| 孔位公差
|
Hole
Position Deviation |
±0.076mm |
| 外形尺寸公差 |
Outline
Tolerance |
±0.13mm |
| 开槽 |
V-cut |
30°/45°/60° |
| 绝缘电阻 |
Insulation
Resistance |
1012(常态)Normal |
| 抗剥强度 |
Peel-off
Strength |
1.4N/mm |
| 阻焊剂硬度 |
Soldermask
Abrasion |
＞5H |
| 热冲击测试 |
Solderability
Test |
260℃20(秒)second |
| 可燃性
|
Flammability |
94v0 |
| 通断测试电压 |
E-test
Voltage |
50-250v |
| 成品翘曲板度 |
Bow/Twist |
1% |
| 品质标准 |
Quality
Standard |
IPC-A600F/MIL-STD-105D |
|
